Global Semiconductor Bonding Market Size, Share, Trend, Growth, and Forecast Report 2030
In 2022, the size of the global semiconductor bonding market was estimated to be $1.8 billion, and it is expected to reach $3.9 billion by the end of 2030 with a CAGR of roughly 3.12% between 2023 and 2030.
Global Semiconductor Bonding Market: Synopsis
A material with the property of electrical conductivity is known as a semiconductor. Additionally, the arrangement of atoms in a semiconductor is in the form of a homogenous structure, and the model of semiconductor bonding is employed in the production of a big number of different pieces of fabrication equipment as well as a great number of integrated circuits. In addition, the molecules that makeup semiconductors might be anything from silicon to gallium arsenide. In recent years, there has been an increase in demand for stacked die systems in IoT equipment, as well as an increase in the popularity of hybrid and electric vehicles. Both of these trends have contributed to an increase in the popularity of semiconductor bonding. Additionally, semiconductors, which are also known as integrated circuits, are beneficial to the development of the digital economy. Semiconductors are the “brains” of modern electronic gadgets such as televisions, tablets, smartphones, and laptops. They are made up of a huge number of microscopic electronic components that are coupled to one another.
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Semiconductor Bonding Market: Growth Factors
a significant increase in the use of semiconductor bonding equipment in the consumer electronic products, aerospace, and medical industries to stimulate growth in international market trends
Moore’s law and the general trend of falling prices for semiconductors are two factors that have contributed to the extraordinary expansion of the electronics industry over the past few decades. Because of this, there has been an increase in the need for semiconductors in the electronics industry, which has paved the way for the worldwide semiconductor bonding market to experience lucrative growth. The introduction of innovative technologies such as artificial intelligence, power-efficient sensing devices, brain-inspired computing, robotics, and automated equipment has made a major contribution to the expansion of the global market. In addition, the bonding of semiconductors is a very complicated process, and its uses may be found in consumer electronics items, computing, and communication equipment, as well as in the aerospace, medical, retail, and retail sectors.
Semiconductor Bonding Market: Segmentation
The global market for semiconductor bonding may be broken down into five distinct categories: bonding technique, application, process type, and geography.
Flip chip bonders, die bonders, and wafer bonders are the three types of machines that make up the various submarkets that make up the global semiconductor bonding market. It would appear that the wafer bonder segment, which held the leading share of the global market in 2022, is poised to maintain its overall market dominance over the course of the forecast timeline. The capacity of the wafer bonder to precisely maintain the orientation between the two bonded surfaces of the semiconductor is responsible for the segmental surge, which may be attributed to the phenomenon.
Semiconductor Bonding Market: Regional Insights
In the period 2023-2030, the Semiconductor Bonding Market in the Asia-Pacific Zone is Expected to Record the Highest CAGR.
It is anticipated that the market for semiconductor bonding in Asia-Pacific would have the highest growth rate during the period of time covered by the projections. It is possible to attribute the expansion of the regional market over the period of 2023-2030 to the fact that China, Taiwan, and South Korea are the main makers of semiconductors in the globe. In addition to this, the existence of important manufacturers in the region will contribute significantly to the expansion of the regional market over the course of the next years.
Semiconductor Bonding Market: Competitive Space
The global semiconductor bonding industry profiles key players such as:
Kulicke & Soffa
Moschip Technologies Ltd
Tata Elxsi Ltd
Shinkawa Ltd
Shibaura Mechatronics
Yamaha Motor Robotics Corporation Co.
Fuji Corporation
SPEL Semiconductor Ltd
Panasonic Corporation
SUSS MicroTech SE
ASM Pacific Technology Ltd.
Fasford Technology
EV Group
Ruttonsha International Rectifier Ltd
Dixon Technologies (India) Ltd
BE Semiconductor Industries N.V.
The global semiconductor bonding market is segmented as follows:
By Type
Die Bonder
Wafer Bonder
Flip Chip Bonder
By Application
RF Devices
3D NAND
CMOS Image Sensors
LED
MEMS & Sensors
By Process Type
Die-to-Die Bonding,
Wafer-to-Wafer Bonding
Die-to-Wafer Bonding
By Bonding Technology
Die Bonding Technology
Wafer Bonding Technology
By Region
North America
The U.S.
Canada
Europe
France
The UK
Spain
Germany
Italy
Rest of Europe
Asia Pacific
China
Japan
India
South Korea
Southeast Asia
Rest of Asia Pacific
Latin America
Brazil
Mexico
Rest of Latin America
Middle East & Africa
GCC
South Africa
Rest of Middle East & Africa
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